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ISL12022M
31
FN6668.9
June 20, 2012
Package Outline Drawing
M20.3
20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE (SOIC)
Rev 3, 2/11
7. The lead width as measured 0.36mm (0.14 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
DETAIL "X"
SIDE VIEW
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
13.00
0.75
0.25
x 45°
0.32
0.23
MAX
8°
1.27
0.40
10.65
10.00
7.60
7.40
20
12
3
INDEX
AREA
2.65
2.35
0.30
MAX
BSC
1.27
0.35
0.49
0.25 (0.10) MC
S
B
M
A
0.10 (0.004)
0.25 (0.10) MB M
1
2
1.27 BSC
(9.40mm)
SEATING PLANE
(0.60)
(2.00)
2
20
3
5
7
NOTES:
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. Dimension does not include mold flash, protrusions or gate
3. Dimension does not include interlead lash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
5. Dimension is the length of terminal for soldering to a substrate.
6. Terminal numbers are shown for reference only.
8. Controlling dimension: MILLIMETER.
9. Dimensions in ( ) for reference only.
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
(0.024 inch)
10. JEDEC reference drawing number: MS-013-AC.
12.60
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